Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

Oracle Exalogic Elastic Cloud: System Overview
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn about Oracle Exalogic Elastic Cloud, an Engineered System consisting of software, firmware, and hardware designed to meet the highest standards of reliability, serviceability and performance.
Posted: 09 Apr 2012 | Published: 15 Sep 2011

Oracle Corporation

Cisco UCS C-Series Rack Servers for Microsoft Exchange 2010
sponsored by Insight
WHITE PAPER: Explore this solution brief to learn about an innovative rack server series specifically designed to help organizations deploy and effectively run Microsoft Exchange Server environments. Learn more about the advanced features and benefits of this hardware.
Posted: 22 Apr 2013 | Published: 22 Apr 2013

Insight

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

Extending Your Data Center Affordably – Empowering the Remote or Branch Office with Simplicity
sponsored by Dell India
WHITE PAPER: Check out this game-changing white paper to find out how the Dell VRTX can fuel your remote offices and eliminate common challenges, at a price you can afford.
Posted: 24 Feb 2014 | Published: 31 Dec 2013

Dell India

A reference architecture for a leading solution
sponsored by DellEMC and Intel®
WHITE PAPER: This white paper explores the reference architecture for a leading server solution. Learn how this architecture is designed to influence the benefits of virtualizing the underlying infrastructure and address the common problems associated with hardware sprawl.
Posted: 21 Oct 2014 | Published: 30 Sep 2014

DellEMC and Intel®